A practical lignin-based adhesive for waferboard/OSB

An exterior grade adhesive dispersion, based on ammonium spent sulfite liquor (NH4SSL), an alkaline phenol-formaldehyde (PF) resin, and an acid catalyst was prepared and evaluated for the production of waferboard. Some of the factors affecting its curing properties included the source of NH4SSL, the lignin to carbohydrate ratio, the molecular weight distribution of PF, and the pH. This resin appears to have considerable potential as a low-cost exterior grade adhesive for waferboard/OSB since NH4SSL is available at a fraction of the cost of PF. Results indicate that a NH4SSL-PF resin that contains up to 50 percent NHSSL solids had curing and adhesive properties similar to commercial PF resins currently used as face resins in the industrial manufacture of 3-layer waferboards.

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