Maximizing Aspen Poplar Residue Utilization for Waferboard Production

Aspen poplar trees of 20-, 70-, 150-, and 360-mm butt diameter with or without bark, branches, and unmerchantable boles were used for the manufacture of waferboards. Panels 11.1 mm thick were prepared with 2.5 percent phenolic resin at a press time of 5 minutes at 210?C. Homogeneous waferboards of excellent quality were produced from trees with butt diameters above 70 mm. Inclusion of bark and branches in the furnish did not cause extensive reduction in board quality. Further, if the lower quality whole-tree wafers were confined to the core layer of a three-layer panel, only a slight reduction in panel properties was observed.

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