Effect of Resin Content and Density on Acoustic Emission from Particleboard During Internal Bond Testing

Handmade particleboard, representing a wide range of density and resin levels, was tested for internal bond (IB) while monitored for acoustic emission (AE) events. The 175-kHz AE sensor was mounted directly to the loading block attached to the specimen. Previous work has established a clear relationship between nominal AE events and IB for production industrial board, which was reaffirmed for the handmade boards. In addition, the total events to failure correlated to resin level, implying proportionality of events to number of bonds failing. A semilogarithmic relation ship of events to load correlated well with IB, particularly at higher failure levels. Boards with IB above 800 kPa appeared to have a bimodal peak amplitude distribution, indicating wood as well as resin failure.

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