High Temperature Adhesive

A semi-organic-inorganic adhesive with high heat resistance was mixed from an alkali metal silicate (sodium silicate) and a phenol formaldehyde resole resin. The method for preparing the phenol formaldehyde resole resin is given. The adhesive can find use in high temperature applications such as wall panels and fire door composites. Various formulations can be used to obtain particular physical properties.

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