The Dielectric Properties of Resin Glues for Wood

Conductivity at constant temperature for the resorcinol and phenol formaldehyde adhesives tested shows no variations with time during working life. For urea adhesives, the conductivity decreased with time by 10 percent per hour. Conductivity of a melamine showed a sharp drop near the end of its working life. The dielectric constant showed little change with time or temperature. Conductivity of the various adhesives showed a 6 to 8 fold increase from room temperature to 100?C. The conductivity of one urea glue tested at 1 megacycle increased with added salt but at a rate that decreased with an increase in concentration and viscosity. The conductivity of several urea adhesives was found to increase directly with the amount of catalyst added.

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