A method has recently been developed to measure wear at the cutting edge of chipper and waferizing knives. Wear at the cutting edge affects the yield and quality of the chips produced, thereby increasing the manufacturing cost. Factors such as downtime and power consumption will increase if optimal cutting is not maintained. Measuring the wear at the cutting edge where the sharpness angle varied from 24? to 30? is a difficult problem and profiles must be carefully taken. The material for taking the initial and final profiles must not shrink away from the cutting edge. An inverse epoxy molding method was developed to measure the initial and final profiles from which the wear was calculated. This method proved to be reliable for measuring the wear at the cutting edge.
You must be logged in to download any documents. Please login (login accounts are free) or learn how to Become a Member