A Non-Destructive Test of Glue-Bond Quality
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A non-destructive vibration technique for measuring resonant frequency and logarithmic decrement (rate of decay of vibration) was applied to two-ply laminated wood specimens containing four types of gluing defects. The log-decrement measurement detected unbonded areas in the assemblies which exceeded 12 percent of the total glueline area, by comparison with log-decrement measurements on assemblies made without defects.
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