Assessment of preservative-treated aspen waferboard after 5 years of field exposure

Laboratory aspen waferboard panels bonded with phenol-formaldehyde resin and treated with different preservatives were exposed on test fences (six preservatives) and buried to half their height (four preservatives) in Minnesota and Mississippi. After 5 years of exposure, ammoniacal copper arsenate (ACA) treatment resulted in the highest combined average modulus of rupture (MOR) for all three exposures (fence, and above and below the groundline). ACA, for all practical purposes, was the only treatment to survive the below-groundline exposure. For the 5-year fence exposures, the untreated (UNT), copper-fluorine-wax formulation (CFW), 3-iodo-2-propynyl butyl carbamate (IPBC), and copper-8-quino-linolate (CU8) had MORs similar to ACA. For above-groundline exposure, only UNT and CFW were similar to ACA. Resistance to Pilodyn pin penetration was greatest for above- and belowground portions of ACA-treated panels. White-rot fungi (predominately Phanerochaetae) were considered major agents of decay at both exposure plots.

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