Bonding of Particleboard Using Hydrogen Peroxide, Lignosulfonates, and Furfuryl Alcohol: The Effect of Process Parameters

Seeking alternatives to synthetic adhesives for bonding wood, a new system for bonding particleboard was investigated. This system involved chemical activation of the surfaces of wood flakes with hydrogen peroxide and cross-linking with a mixture of ammonium lignosulfonate, furfuryl alcohol, and maleic anhydride. Using these chemicals as bonding agents, Douglas-fir particleboards, at a density of about 0.73 g/cm3, were pressed at four temperatures (250?, 300?, 350?, and 400?F) for 6 minutes or at 300?F and 350?F for 4, 6, 8, and 10 minutes. Other variables were the level of hydrogen peroxide (1, 1.5, 2., and 3 percent) and addition of wax (0.5, 1., and 2. percent). Board properties were as follows: IB = 66 to 144 psi, MOR = 3,500 to 4,331 psi, MOE = 678,000 to 876,000 psi, TS after 2 hours in boiling water = 9.4 to 87.2 percent and TS after 24 hours in cold water soak = 3.3 to 35.5 percent. Within the experimental conditions used, increasing the amount of peroxide from 1 to 3 percent, pressing temperature from 250? to 350?F, or pressing time from 4 to 8 minutes, resulted in better boards. Almost all the boards were comparable to boards made with conventional phenol-formaldehyde resin in terms of strength and water resistance. The main advantage of the experimental bonding system appears to lie in the fact that the cross-linking chemicals used are manufactured from wood pulping residues and agricultural byproducts.

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