Commercial trials of a lignin-phenolic waferboard adhesive

Work at Forintek has shown that a new ammonium-based spent sulfate liquor (SSL) phenol-formaldehyde (PF) acid dispersion adhesive (NH4SSL-PF) had curing properties similar to commercial PF surface resin used for the manufacture of three-layer waferboards. To be commercially acceptable, a surface adhesive must be pre-cure resistant, available as a stable liquid or powder, and cure under current commercial pressing conditions. By adjusting the molecular weight distribution of the PF copolymer, it was possible to optimize the reactivity of the NH4SSL-PF adhesive and facilitate its spray-drying. High performance liquid chromatography studies indicated that SSL reacted with PF to form water insoluble compounds during panel pressing. The addition of NH4SSL to PF improved its pre-cure resistance. Through collaboration with a resin manufacturer, a sodium-based resin powder (NaSSL-PF) was produced in large quantities and tested in two Canadian waferboard mills.

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