Comparison of Three Methods for Dimensionally Stabilizing Wafer-Type Particleboard

Particleboard was manufactured in the laboratory from balsam poplar (Populus balsamifera) wafers which had been pre-treated with 3, 6, or 12 percent impregnating phenol formaldehyde (IPF) resin and non-impregnated wafers. Non- impregnated boards were tested with no treatment, after post-steaming in 360?F saturated steam for 10 minutes, or after post-heat treatment for 2 hours at 425? F. All treatments had favorable effects upon thickness stability. The most effective treatments were post-steaming and 12 percent IPF resin. These two treatments were equally effective in controlling dimensional stability, while post-heating compared closely with 6 percent IPF resin. Pre-treatment with 12 percent IPF resin and post-steaming were the only treatments to significantly, reduce linear swell. The addition of any level of IPF resin appeared to effectively control linear springback.

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