Improving Mill Waferboard Properties By X-Ray-Densitometer Evaluation Methods

Vertical density profiles for commercial waferboards were determined by a X-ray densitometer method. Information regarding the non-homogeneous density distribution was reported back to the mill and subsequent changes in pressing schedule resulted in boards with improved density distribution. Improvements in physical properties, such as IB (internal bond) and NOR (modulus of rupture) were found following pressing schedule alterations. In particular, lB increased 10 to 25 percent, while wet MOR increased by about 100 percent.

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