Influence of Paper Birch on the Properties of Aspen Waferboard: A Mill Trial

The properties of 7/16-inch commercial waferboard manufactured from a wafer mixture of 70 percent aspen – 30 percent paper birch by weight compared favorably to those of all-aspen waferboard. Modulus of rupture (MOR), modulus of elasticity (MOE), and internal bond (IB) of the aspen-birch board ranged from 90 to 96 percent of those of the all-aspen board. After the Canadian Waferboard Standard CAN-0188.0-M78 2-hour boil, the MOR and MOE of the aspen-birch boards were, respectively, 87 and 96 percent of those of the all-aspen boards. The information from previous laboratory studies indicates that if birch content were reduced to 10 to 15 percent there would be little or no differences between aspen-birch and all-aspen boards.

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