Influence of the Amount and Type of Phenolic Resin on the Properties of a Wafer-Type Particleboard

Wafer-type particleboard was produced from balsam poplar utilizing 3 percent phenolic bonding resin. Boards were also produced from wafers which had been treated with 7 percent phenolic impregnating resin applied when the wafers were green and also when dried. One VPS cycle resulted in a 13 percent decrease in MOR, a 38 percent decrease in IB, and little change in the El product for the standard board. For the boards treated with impregnating resin there was an average of a 2 percent loss in MOR, a 22 percent decrease in IB and an 8 percent increase in EI product resulting from VPS. The surface characteristics of the treated boards were visably improved by the impregnation treatments (as viewed after VPS). The boards with wafers impregnated green were notably superior. The range in thickness of the standard boards after VPS was about 0.12 inches as compared to 0.06 inches for the impregnated boards. Thickness swell and springbuck were reduced to about 1/2 the control values by the addition of the 7 percent impregnating resin.

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