Isocyanate Bonded Aspen Flakeboard

This study reports on the effects and interactions of varying moisture contents (MCs), press temperatures, and post-cure on the modulus of rupture (MOR), modulus of elasticity (MOE), wet MOR, and internal bond (IB) of isocyanate bonded flakeboards. Moisture contents were 4 percent, 10 percent, and 18 percent; press temperatures were 300?F, 350?F, and 400?F. All boards were pressed to a constant density profile by varying the press closing rates. Three percent isocyanate was used without wax. The most important process variable was mat MC. In all cases, the 18 percent MC boards were weaker than either the 4 percent or 10 percent MC boards. The differences between the 4 percent and 10 percent boards was typically not statistically different. Isocyanate bonded aspen flakeboards can be made at press temperatures as low as 300?F. Differences between undercured and adequately cured boards can result from as little as 15 seconds difference in press time and appear to be a function of both press temperature and MC. Post-cure had a minor positive effect on board properties.

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