Physical Properties of Phenolic Bonded Wafer-Type Particleboard from Mixtures of Aspen, Paper Birch, and Tamarack

The effect on the physical properties of phenolic bonded wafer-type aspen particleboard by the addition of paper birch and tamarack was evaluated. Laboratory boards were manufactured at densities of 38, 43, and 48 lb./ft.3 from pure aspen, birch, and tamarack and from seven mixtures of the three. Wafer size was 1-1/2 inches long by 0.027 inches thick by random width. Aspen and tamarack were superior to birch as raw materials for wafer-type particleboard at lower densities. The strength properties of all mixtures were good for the high density class. An increase in board density resulted in an increase in MOR, MOE, IB, and total and irreversible thickness swell, but linear swell was not significantly affected. Based upon the property values from an average the three density levels, the addition of either birch or tamarack decreased MOE and linear stability but increased thickness stability. Tamarack did not influence MOR but birch caused a decrease. Tamarack tended to increase IB, but birch showed no effect. Tamarack greatly increased resistance to decay fungi. The results indicate that the addition of one third birch or two, thirds tamarack or a mixture of the two not exceeding perhaps one third, to a basic aspen furnish would appear to produce an acceptable wafer-type particleboard.

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