Steam-Press Process for Curing Phenolic-Bonded Particleboard

A new pressing process has been developed to cure phenolic-bonded particleboard in a very short press time. This new process involves the injection of high-pressure steam through the mat surface using specially designed press platens and a sealing frame. By directly injecting high- pressure steam into the mat, the cure of resin binder in the particleboard can be rapidly achieved. For example, l-inch thick phenolic maple particleboard at 45 lbs./cu.ft. density, was fully cured in 1 minute at a steam pressure of 300 psi (430?F). The same board would take at least 15 minutes at 430?F platen temperature using the conventional platen pressing method. Five-inch thick particleboard was fully cured in less than 11 minutes at a steam pressure of 200 psi (380?F). Strength properties of the steam-pressed boards were found to equal those of conventionally pressed boards. However, thickness expansion and water absorption for the steam-pressed boards were considerably reduced. This new steam-pressing technique should have great potential, for development into an industrial process.

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