Strength Reductions in Particleboard Caused By Fungi

Laboratory tests to determine, respectively, the effect of fungi and watersoaking on the IB strengths and static bending properties (MOR and MOE) of a variety of commercially produced phenol- and urea-bonded, graded-density, particleboards showed that strength losses of board samples incubated with fungi were considerably greater than losses in samples submerged for extended periods in water. Strength reduction was not always associated with weight loss of the sample, suggesting deterioration of the wood-glue bond. The deleterious effects which fungi produce in composite wood products should be considered in design of exposure and service tests which seek to determine service life of particleboard in exterior or high-risk (decay) interior use.

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