Tension, Compression, and Shear Properties of Waferboard from Small-Specimen Tests

Tension, compression, and shear properties of three waferboards and one additional phenolic-bonded flakeboard, all commercial products, were determined by test methods in ASTM Standards D 1037 and D 3044. Tensile strengths parallel to the surface (1,120 to 1,360 psi) and edgewise shear strengths (1.150 to 1,410 psi) were nearly equal for all four materials. The compressive strength of waferboard (1,410 to 1,760 psi) was 12 to 30 percent greater than its tensile strength. Flakeboard compressive strength (2,930 psi) was 2.3 times the tensile strength. For interlaminar shear, strength values ranged from 180 to 360 psi, and shear modulus values ranged from 21,600 to 51,300 psi. Plate shear modulus values ranged from 200,000 to 230,000 psi. Because of the large size of the wood particles in relation to the specimen, waferboard data were more variable than flakeboard data.

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