Treatments to Reduce Thickness Swelling of Phenolic-Bonded Particleboard

A 10-minute treatment of phenolic-bonded particleboard in saturated steam at 360?F. was exceedingly effective in reducing thickness swelling and springback. The treatment had little effect on linear movement, and produced only moderate reduction in bending strength and internal bond. Variables such as species, density, resin content, and particle shape produced minor changes in the effectiveness of the treatment. Post-treatment in hot air (2 hours at 425?F.) was equally effective in reducing springback, but severely dried the boards. The use of superheated steam and pretreatment of flakes with saturated steam at 360?F. were relatively ineffective.

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