Wood Density and Board Composition Effects on Phenolic Resin-Bonded Flakeboard

Selected factors affecting the resistance of particleboard aging were studied. Emphasis was placed on variables thought to relate to compaction, crushing, and the role of interparticle bonding as they affect the permanence of panel consolidation. A range of wood densities, board densities, and resin contents were studied, with particular attention to the “compaction ratio”concept of board and wood density interaction. Special problems were encountered in flaking and pressing with the lower-density wood (basswood). However, trends in the effect of compaction ratio are seen in that the higher ratios seem to lead to higher mechanical property values but also to higher thickness swelling especially in the WCAMA six-cycle accelerated aging test. Insofar as particleboard’s weather resistance is dependent upon permanence of original panel consolidation, these data suggest that moderate compaction ratios and higher resin contents are a step in the right direction. Substantial further study is indicated and some important unresolved issues are outlined.

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